Title :
Parasitic extraction and performance evaluation of a high I/O package
Author :
Subramanian, Rajagopal ; Swaminathan, Madhavan ; Behar, Moises
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
This paper discusses the parasitic extraction of a high I/O package using TDR (time domain reflectometry) measurements. The package that was considered was the VSPA (very small peripheral array), a unique high I/O package due to the 3D structure of the package pins
Keywords :
integrated circuit interconnections; integrated circuit measurement; integrated circuit packaging; time-domain reflectometry; 3D package pin structure; TDR measurements; VSPA package; high I/O package; parasitic extraction; performance evaluation; time domain reflectometry; very small peripheral array package; Electronic packaging thermal management; Electronics packaging; Equivalent circuits; Frequency measurement; Magnetostatics; Pins; Printed circuits; Reflectometry; Thermal conductivity; Time measurement;
Conference_Titel :
Electronics Packaging Technology Conference, 1998. Proceedings of 2nd
Print_ISBN :
0-7803-5141-X
DOI :
10.1109/EPTC.1998.755986
