A high speed image preprocessing method for IC wafer inspection

Author

Wei Chen ; Li-Ming Wu ; Shan-Ling Cui

Author_Institution

Fac. of Inf. Eng., Guangdong Univ. of Technol., Guangzhou

fYear

2008

fDate

28-31 July 2008

Firstpage

1

Lastpage

3

Abstract

A lot of vital defects appear in the process of fabrication of IC wafer. Material defect which mainly causes circuits to be connection failure is an important factor of reducing the yield of IC. So the inspection of material defect is one of the most important things to do for guaranteeing the quality of IC. In this paper, a machine visual test system is designed with AOI (automated optical inspection) technology. The surface defects and geometric sizes of the IC wafer can be detected automatically. It introduces the method of image convolution of FPGA, by using assembly pipelining mode to design a real-time median filtering, to apply to the IC chip testing system which has good effect. Defect feature extraction and selection techniques were studied regarding the characteristics of inspection images of IC wafer. This machine vision test system is realized by FPGA based on XILINX Spartan-3A which is a high-speed parallel device.

Keywords

automatic optical inspection; computer vision; convolution; electronic engineering computing; feature extraction; field programmable gate arrays; integrated circuit testing; median filters; AOI technology; FPGA; IC chip testing system; IC wafer inspection; assembly pipelining mode; automated optical inspection technology; defect feature extraction techniques; defect feature selection techniques; high speed image preprocessing method; image convolution method; machine vision test system; machine visual test system; real-time median filtering; surface defects; Circuit testing; Fabrication; Field programmable gate arrays; High speed integrated circuits; Inspection; Integrated circuit testing; Optical filters; Optical materials; Photonic integrated circuits; System testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4244-2739-0

Electronic_ISBN

978-1-4244-2740-6

Type

conf

DOI

10.1109/ICEPT.2008.4607103

Filename

4607103