Title :
Polyimide/copper thin film multilayer for VLSI interconnection
Author :
Droguet, J.P. ; Coulibaly, A. ; Kavass, M. ; Marcel, T. ; Teissier, G.
Author_Institution :
Thomson Hybrides, Massy, France
Abstract :
The characteristics of multichip modules (MCMs) with TFML are reviewed. The Thomson Hybrides MCMP five-layer technology is then examined, with particular attention given to the multilayer stack description, a process outline, and the layout design rules. Application examples are then considered, including a logic controller for an automatic system and a memory board.<>
Keywords :
VLSI; hybrid integrated circuits; polymer films; thin film circuits; MCM; MCMP five-layer technology; TFML; Thomson Hybrides; VLSI interconnection; automatic system; characteristics; layout design rules; logic controller; memory board; multichip modules; multilayer stack; polyimide Cu thin film multilayer; process outline; Copper; Delay; Frequency; Multichip modules; Nonhomogeneous media; Polyimides; Substrates; Testing; Transistors; Very large scale integration;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1990, IEMT Conference., 8th IEEE/CHMT International
Conference_Location :
Baveno, Italy
DOI :
10.1109/IEMT8.1990.171051
