Title :
Dynamic phase-frequency characteristic of thermosonic wire bonder transducer
Author :
Wang, Fuliang ; Zou, Changhui ; Qiao, Jiaping
Author_Institution :
Coll. of Mech. & Electron. Eng., Central South Univ., Changsha
Abstract :
The resonant frequency of transducer is changed with the state of thermosonic wire bonding interface. The ultrasonic generator need to trace the frequency of transducer, and keep the stimulate frequency consist with the resonant frequency of transducer. The frequency tracking strategy is based on the phase-frequency transducer. The dynamic phase-frequency characteristic was measured with a new FPGA based ultrasonic generator. The dynamic phase-frequency characteristic shows that the stimulation frequency may change by the generator quickly, but the change of phase difference between voltage and current of stimulate electronic signal need 12 ms or much longer time, and the final stable phase is much different with the static phase-frequency characteristic measured by HP4191A. This may be one reason for the phase tracking need 3-5 ms.
Keywords :
electronics packaging; field programmable gate arrays; lead bonding; ultrasonic transducers; FPGA based ultrasonic generator; HP4191A; frequency tracking; phase tracking; phase-frequency transducer; thermosonic wire bonder transducer; thermosonic wire bonding interface; time 3 ms to 5 ms; transducer resonant frequency; Bonding; Character generation; Field programmable gate arrays; Phase measurement; Resonant frequency; Signal generators; Ultrasonic transducers; Ultrasonic variables measurement; Voltage; Wire; Thermosonic wire bonding; frequency tracking; phase-frequency characteristic; transducer; ultrasonic generator;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-2739-0
Electronic_ISBN :
978-1-4244-2740-6
DOI :
10.1109/ICEPT.2008.4607106