Title :
Experimental investigations on a closed mini thermosyphon
Author :
Ma, Z.N. ; Sobhan, C.B. ; Wong, T.N. ; Huang, X.Y.
Author_Institution :
Sch. of Mech. & Production Eng., Nanyang Technol. Univ., Singapore
Abstract :
A closed mini thermosyphon has been developed and studied experimentally. The aim of the study is to develop a simple closed circulation device for heat dissipation from electronic systems. The thermosyphon consists of an evaporator with two square flat surfaces of 16 cm2 area each, and a condenser equipped with an array of external tapered fins for enhanced heat dissipation. Experiments have been conducted on the thermosyphon to study its performance at various heating levels, with natural and forced convection at the condenser section. Transient and steady state temperature profiles along the thermosyphon walls are measured for various heat inputs. Results show that the thermosyphon under study allows a heat dissipation rate up to 1.44 W/cm2 under forced convection, without exceeding moderate temperature levels, in the range of air velocities used
Keywords :
condensation; cooling; electronic equipment testing; evaporation; forced convection; natural convection; temperature distribution; thermal analysis; thermal management (packaging); air velocities; closed circulation device; closed mini thermosyphon; condenser; condenser section; electronic systems; evaporator; external tapered fin array; forced convection; heat dissipation; heat dissipation rate; heat input; heating levels; natural convection; steady state temperature profiles; temperature levels; thermosyphon; thermosyphon walls; transient temperature profiles; Electronic packaging thermal management; Heat engines; Heat recovery; Heat transfer; Heating; Maintenance engineering; Production engineering; Steady-state; Temperature distribution; Thermal conductivity;
Conference_Titel :
Electronics Packaging Technology Conference, 1998. Proceedings of 2nd
Print_ISBN :
0-7803-5141-X
DOI :
10.1109/EPTC.1998.755994
