Shear of Sn-3.8Ag-0.7Cu solder balls on electrodeposited FeNi layer

Author

Zhu, Q.S. ; Guo, J.J. ; Wang, Z.G. ; Zhang, Z.F. ; Shang, J.K.

Author_Institution

Shenyang Nat. Lab. for Mater. Sci., Chinese Acad. of Sci., Shenyang

fYear

2008

fDate

28-31 July 2008

Firstpage

1

Lastpage

4

Abstract

The interfacial reaction between Sn-3.8Ag-0.7Cu solder and FeNi substrate was much slower, resulting in a thin FeSn₂ IMC layer at the interface. Interfacial bond between FeNi and Sn-3.8Ag-0.7Cu solder ball was examined by ball shear tests and the shear test results were compared to those on Cu and deposited Ni layers. Ball shear test showed that the Sn-Ag-Cu/FeNi-Cu interface had a comparable strength to that of Sn-Ag-Cu/Cu interface and the shear strength was relatively constant when reflow time increased from 2 minutes to over 15 minutes. The shear fracture occurred within the solder near the interface. Therefore, the electrodeposited FeNi layer may be used as a reliable under ball metallization (UBM).

Keywords

copper alloys; electrodeposits; fracture; iron alloys; nickel alloys; shear strength; silver alloys; solders; surface chemistry; tin alloys; SnAgCu-FeNi; ball metallization; electrodeposited layer; interfacial bond; interfacial reaction; shear fracture; shear strength; shear test; solder ball; time 2 min; Copper; Intermetallic; Materials science and technology; Metallization; Performance evaluation; Scanning electron microscopy; Soldering; Substrates; Surface morphology; System testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4244-2739-0

Electronic_ISBN

978-1-4244-2740-6

Type

conf

DOI

10.1109/ICEPT.2008.4607112

Filename

4607112