IMC formation between electroless Ni/Pd/Au surface finish and SnAgCu solder

Author

Mao, Jiwang ; Liu, Bin ; Li, Ming ; Wang, Yu ; Mao, Dali

Author_Institution

Lab. of Microelectron. Mater. & Technol., Shanghai Jiao Tong Univ., Shanghai

fYear

2008

fDate

28-31 July 2008

Firstpage

1

Lastpage

4

Abstract

The interfacial reaction between OSP, electrolytic Ni/Au, and electroless Ni/Pd/Au surface finish and SnAgCu solder on BGA package were investigated. After multiple reflows, IMC morphology and composition is examined by SEM and EDX. Cu₆Sn₅ formed between LF35 and OSP finish, and Ag₃Sn were found disperse in the solder. Both (Ni_x,Cu_1-x)₃Sn₄ and (Cu_x,Ni_1-x)₆Sn₅ were observed on interface of electrolytic Ni/Au and electroless Ni/Pd/Au surface finish between SAC105.

Keywords

ball grid arrays; copper alloys; electrolysis; gold alloys; nickel alloys; palladium alloys; reflow soldering; silver alloys; surface finishing; tin alloys; BGA package; EDX; IMC formation; IMC morphology; Ni-Pd-Au; SEM; SnAgCu; electroless surface finish; electrolytic surface finish; interfacial reaction; multiple reflows; Electronics packaging; Environmentally friendly manufacturing techniques; Gold; Lead; Nickel; Soldering; Surface finishing; Surface morphology; Temperature; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4244-2739-0

Electronic_ISBN

978-1-4244-2740-6

Type

conf

DOI

10.1109/ICEPT.2008.4607113

Filename

4607113