DocumentCode :
2688328
Title :
IMC formation between electroless Ni/Pd/Au surface finish and SnAgCu solder
Author :
Mao, Jiwang ; Liu, Bin ; Li, Ming ; Wang, Yu ; Mao, Dali
Author_Institution :
Lab. of Microelectron. Mater. & Technol., Shanghai Jiao Tong Univ., Shanghai
fYear :
2008
fDate :
28-31 July 2008
Firstpage :
1
Lastpage :
4
Abstract :
The interfacial reaction between OSP, electrolytic Ni/Au, and electroless Ni/Pd/Au surface finish and SnAgCu solder on BGA package were investigated. After multiple reflows, IMC morphology and composition is examined by SEM and EDX. Cu6Sn5 formed between LF35 and OSP finish, and Ag3Sn were found disperse in the solder. Both (Nix,Cu1-x)3Sn4 and (Cux,Ni1-x)6Sn5 were observed on interface of electrolytic Ni/Au and electroless Ni/Pd/Au surface finish between SAC105.
Keywords :
ball grid arrays; copper alloys; electrolysis; gold alloys; nickel alloys; palladium alloys; reflow soldering; silver alloys; surface finishing; tin alloys; BGA package; EDX; IMC formation; IMC morphology; Ni-Pd-Au; SEM; SnAgCu; electroless surface finish; electrolytic surface finish; interfacial reaction; multiple reflows; Electronics packaging; Environmentally friendly manufacturing techniques; Gold; Lead; Nickel; Soldering; Surface finishing; Surface morphology; Temperature; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-2739-0
Electronic_ISBN :
978-1-4244-2740-6
Type :
conf
DOI :
10.1109/ICEPT.2008.4607113
Filename :
4607113
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2688328
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