In-situ calibration of wire bonder ultrasonic system using integrated microsensor

Author

Mayer, Michael ; Paul, Oliver ; Bolliger, D. ; Baltes, Henry

Author_Institution

Phys. Electron. Lab., Eidgenossische Tech. Hochschule, Zurich, Switzerland

fYear

1998

fDate

8-10 Dec 1998

Firstpage

219

Lastpage

223

Abstract

Based on investigations with an ESEC thermosonic wire bonder, we report a novel ultrasound calibration method which consists of in-situ measurement of the friction heat generated by the gold ball as it scrubs on the oxide of an integrated microsensor. This procedure can be carried out in-process using a dedicated test chip and a modified clamping plate. The calibration dependence on the process parameters of bond force, ultrasonic energy, and initial ball diameter is quantified. The test chip-to-test chip standard variation of the calibration signal taken from a single wire bonder corresponds to a horn amplitude variation of 0.01 μm

Keywords

calibration; friction; heat measurement; integrated circuit packaging; integrated circuit testing; lead bonding; materials handling; microsensors; ultrasonic bonding; bond force; calibration dependence; calibration signal; friction heat; gold ball; horn amplitude variation; in-situ calibration; in-situ measurement; initial ball diameter; integrated microsensor; integrated microsensor oxide; modified clamping plate; process parameters; test chip; test chip-to-test chip standard variation; thermosonic wire bonder; ultrasonic energy; ultrasound calibration method; wire bonder ultrasonic system; Bonding; Calibration; Friction; Gold; Microsensors; Semiconductor device measurement; Testing; Ultrasonic imaging; Ultrasonic variables measurement; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 1998. Proceedings of 2nd

Print_ISBN

0-7803-5141-X

Type

conf

DOI

10.1109/EPTC.1998.756005

Filename

756005