Title :
Effect of displacement rate on lap shear test of SAC solder ball joints
Author :
Wang, X.J. ; Wang, Z.G. ; Shang, J.K.
Author_Institution :
Shenyang Nat. Lab. for Mater. Sci., Chinese Acad. of Sci., Shenyang
Abstract :
Lap-shear tests were combined with elastic-viscoplastic constitutive modeling to study the shear behavior of Sn3.8Ag0.7Cu (SAC) solder ball joints. In the shear rate range of 0.005 mm/s to 0.7 mm/s, the peak shear force was attained an optimal rate (labeled as vo), around 0.3 mm/s. On either side of vo, the shear fracture behavior was quite different. Cross-section examinations of the remaining solder joints after fracture showed that the fracture surface moved towards the solder/IMC interface with an increasing shear rate. Two shear modes were evident: below vo, a cohesive shear fracture controlled by the solder properties and above vo, solder/IMC interface controlled fracture.
Keywords :
elasticity; fracture; materials testing; shear deformation; silver alloys; solders; tin alloys; viscoplasticity; SnAgCu; cohesive shear fracture; displacement rate; elastic-viscoplastic constitutive modeling; fracture surface; lap shear test; solder ball joints; Computational modeling; Copper; Deformable models; Finite element methods; Materials science and technology; Materials testing; Microelectronics; Scanning electron microscopy; Soldering; Surface cracks;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-2739-0
Electronic_ISBN :
978-1-4244-2740-6
DOI :
10.1109/ICEPT.2008.4607118
