Effect of displacement rate on lap shear test of SAC solder ball joints

Author

Wang, X.J. ; Wang, Z.G. ; Shang, J.K.

Author_Institution

Shenyang Nat. Lab. for Mater. Sci., Chinese Acad. of Sci., Shenyang

fYear

2008

fDate

28-31 July 2008

Firstpage

1

Lastpage

4

Abstract

Lap-shear tests were combined with elastic-viscoplastic constitutive modeling to study the shear behavior of Sn3.8Ag0.7Cu (SAC) solder ball joints. In the shear rate range of 0.005 mm/s to 0.7 mm/s, the peak shear force was attained an optimal rate (labeled as v_o), around 0.3 mm/s. On either side of v_o, the shear fracture behavior was quite different. Cross-section examinations of the remaining solder joints after fracture showed that the fracture surface moved towards the solder/IMC interface with an increasing shear rate. Two shear modes were evident: below v_o, a cohesive shear fracture controlled by the solder properties and above v_o, solder/IMC interface controlled fracture.

Keywords

elasticity; fracture; materials testing; shear deformation; silver alloys; solders; tin alloys; viscoplasticity; SnAgCu; cohesive shear fracture; displacement rate; elastic-viscoplastic constitutive modeling; fracture surface; lap shear test; solder ball joints; Computational modeling; Copper; Deformable models; Finite element methods; Materials science and technology; Materials testing; Microelectronics; Scanning electron microscopy; Soldering; Surface cracks;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4244-2739-0

Electronic_ISBN

978-1-4244-2740-6

Type

conf

DOI

10.1109/ICEPT.2008.4607118

Filename

4607118