Title :
Capability study on the destructive pull test of 1 mil gold wire bond and its asymmetric distribution
Author_Institution :
Shenzhen Grad. Sch., Key Lab. of Integrated Microsyst., Peking Univ., Shenzhen
Abstract :
The statistical process control (SPC) of destructive pull test on 1 Au gold wire is studied on two high-rel devices, namely #1 and #2. It was found that the Cpk of both parts are around 1.2, which have not meet our goal of 1.33 and the ultimately six sigma (Cpk= 2). However, this study shows that the traditional method of calculating Cpk has underestimated the capability of process control if considering the tolerance as asymmetric, such as the case for 1 mil gold wire bond.
Keywords :
gold; lead bonding; materials testing; statistical process control; Au; asymmetric distribution; capability study; destructive pull test; gold wire bond; statistical process control; Bonding forces; Control charts; Gold; Military standards; Neck; Packaging; Process control; Temperature; Testing; Wire;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-2739-0
Electronic_ISBN :
978-1-4244-2740-6
DOI :
10.1109/ICEPT.2008.4607119
