DocumentCode
2688450
Title
Capability study on the destructive pull test of 1 mil gold wire bond and its asymmetric distribution
Author
Peng, Jin
Author_Institution
Shenzhen Grad. Sch., Key Lab. of Integrated Microsyst., Peking Univ., Shenzhen
fYear
2008
fDate
28-31 July 2008
Firstpage
1
Lastpage
3
Abstract
The statistical process control (SPC) of destructive pull test on 1 Au gold wire is studied on two high-rel devices, namely #1 and #2. It was found that the Cpk of both parts are around 1.2, which have not meet our goal of 1.33 and the ultimately six sigma (Cpk= 2). However, this study shows that the traditional method of calculating Cpk has underestimated the capability of process control if considering the tolerance as asymmetric, such as the case for 1 mil gold wire bond.
Keywords
gold; lead bonding; materials testing; statistical process control; Au; asymmetric distribution; capability study; destructive pull test; gold wire bond; statistical process control; Bonding forces; Control charts; Gold; Military standards; Neck; Packaging; Process control; Temperature; Testing; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
Conference_Location
Shanghai
Print_ISBN
978-1-4244-2739-0
Electronic_ISBN
978-1-4244-2740-6
Type
conf
DOI
10.1109/ICEPT.2008.4607119
Filename
4607119
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