On the study of the in-use stability of a DCA assembled MEMS device

Author

Xu, Liyuan ; Song, Jing ; Tang, Jieying

Author_Institution

Key Lab. of MEMS of Educ. Minist., Southeast Univ., Nanjing

fYear

2008

fDate

28-31 July 2008

Firstpage

1

Lastpage

5

Abstract

DCA (direct chip attach) is introduced as a main mode for the MEMS (micro-electronics mechanical system) devices packaging. However, thermo-elastic coupling occurred in the DCA package will introduce disturbance stresses and deformations, which may give rise to various packaging effects. In this effort, the in-use structural stability of a packaged MEMS device is further investigated. Susceptibility of a DCA assembled microbridge to in-use stiction with respect to packaging parameters is modeled, estimated and measured.

Keywords

chip scale packaging; deformation; microassembling; micromechanical devices; thermal management (packaging); thermal stresses; thermoelasticity; DCA assembled microbridge; MEMS device packaging; deformation; direct chip attach package; disturbance stresses; in-use structural stability; microelectronics mechanical system; thermo-elastic coupling; Adhesives; Assembly; Capacitive sensors; Costs; Microelectromechanical devices; Micromechanical devices; Packaging; Stability; Structural engineering; Thermal stresses; DCA; MEMS package; in-use stability; peel number; strain distribution;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4244-2739-0

Electronic_ISBN

978-1-4244-2740-6

Type

conf

DOI

10.1109/ICEPT.2008.4607123

Filename

4607123