Cavitation instability in Valanis-Landel hyperelastic IC packaging material

In this paper, a representative material cell containing a single microvoid is used to investigate void growth under combined vapor pressure and thermal stress. The plastic IC packaging material is assumed to be Valanis-Landel hyperelastic materials. Using the theory of cavity formation and unstable void growth in incompressible hyper-elastic material, we gained an analytical relation between the applied traction (moisture-induced vapor pressure and thermal stress) and void volume fraction in forementioned materials. Numerical analysis showed that the critical stress is existent and the critical stress decreases with increase of the initial porosity.