Title :
Cavitation instability in Valanis-Landel hyperelastic IC packaging material
Author :
Zhigang, Li ; Xuefeng, Shu
Author_Institution :
Inst. of Appl. Mech. & Biomed. Eng., Taiyuan Univ. of Technol., Taiyuan
Abstract :
In this paper, a representative material cell containing a single microvoid is used to investigate void growth under combined vapor pressure and thermal stress. The plastic IC packaging material is assumed to be Valanis-Landel hyperelastic materials. Using the theory of cavity formation and unstable void growth in incompressible hyper-elastic material, we gained an analytical relation between the applied traction (moisture-induced vapor pressure and thermal stress) and void volume fraction in forementioned materials. Numerical analysis showed that the critical stress is existent and the critical stress decreases with increase of the initial porosity.
Keywords :
cavitation; integrated circuit packaging; plastic packaging; porosity; thermal stresses; traction; voids (solid); Valanis-Landel hyperelastic material; cavitation instability; cavity formation; critical stress; incompressible hyperelastic material; integrated circuit packaging; microvoid; moisture-induced vapor pressure; plastic IC packaging material; porosity; thermal stress; traction; unstable void growth; vapor pressure; void growth; void volume fraction; Biological materials; Biomedical materials; Electronic packaging thermal management; Integrated circuit packaging; Internal stresses; Moisture; Numerical analysis; Plastic integrated circuit packaging; Plastic packaging; Thermal stresses; hyperelastic material; unstable void growth; vapor pressure;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-2739-0
Electronic_ISBN :
978-1-4244-2740-6
DOI :
10.1109/ICEPT.2008.4607127
