DocumentCode
2688639
Title
Packaging structures utilizing new `pinless´ grid array technologies and vacuum well processes to provide enhanced reliability and circuit densities
Author
Nunally, Patrick
fYear
1989
fDate
15-18 May 1989
Abstract
An innovative technology that yields greater VLSI/VHSIC packaging densities and reliability while meeting military requirements including solderability and inspectability. The approach is called pinless grid array (PLGA) technology. Its reliability is examined, and its capability for increasing radiation hardness of electronic systems is briefly discussed
Keywords
VLSI; circuit reliability; digital integrated circuits; integrated circuit technology; packaging; radiation hardening (electronics); VHSIC; VLSI; circuit densities; digital IC; inspectability; military requirements; packaging densities; pinless grid array; radiation hardness; reliability; solderability; vacuum well processes;
fLanguage
English
Publisher
ieee
Conference_Titel
Custom Integrated Circuits Conference, 1989., Proceedings of the IEEE 1989
Conference_Location
San Diego, CA, USA
Type
conf
DOI
10.1109/CICC.1989.56751
Filename
5726218
Link To Document