Title :
Packaging structures utilizing new `pinless´ grid array technologies and vacuum well processes to provide enhanced reliability and circuit densities
Author :
Nunally, Patrick
Abstract :
An innovative technology that yields greater VLSI/VHSIC packaging densities and reliability while meeting military requirements including solderability and inspectability. The approach is called pinless grid array (PLGA) technology. Its reliability is examined, and its capability for increasing radiation hardness of electronic systems is briefly discussed
Keywords :
VLSI; circuit reliability; digital integrated circuits; integrated circuit technology; packaging; radiation hardening (electronics); VHSIC; VLSI; circuit densities; digital IC; inspectability; military requirements; packaging densities; pinless grid array; radiation hardness; reliability; solderability; vacuum well processes;
Conference_Titel :
Custom Integrated Circuits Conference, 1989., Proceedings of the IEEE 1989
Conference_Location :
San Diego, CA, USA
DOI :
10.1109/CICC.1989.56751
