The effect of strain rate and strain range on bending fatigue test

Author

Lou, Minyi ; Wen, Long ; Chen, Zhengrong ; Zhou, Jianwei ; Wang, Qian ; Lee, Jaisung

Author_Institution

Samsung Semicond. (China) R&D Co., Ltd., Suzhou

fYear

2008

fDate

28-31 July 2008

Firstpage

1

Lastpage

5

Abstract

Therepsilare many kinds of bending test conditions according to different control modes: displacement control, force control and strain control. In our paper, strain-controlled bending test was chosen, since the lifetime and failure modes were more sensitive relating to different loading strain range and strain rate. ANSYS was used to simulate the bending test to predict board level solder joint reliability. The relationship between loading strain range and lifetime for 60BOC was measured in a similar type to Coffin-Manson equation. 5 failure modes were investigated, component side bulk crack, component side IMC interface crack, board side bulk crack, board side IMC interface crack and pad lift. The simulation results indicated that with the increase of strain range, the fatigue performance of device decreased.

Keywords

bending; cracks; displacement control; failure analysis; fatigue testing; finite element analysis; force control; integrated circuit reliability; integrated circuit testing; soldering; solders; strain control; 60BOC lifetime measurement; ANSYS; Coffin-Manson equation; PWB assemblies; bending fatigue test; bending test conditions; board level solder joint reliability; board side IMC interface crack; board side bulk crack; component side IMC interface crack; component side bulk crack; device fatigue performance; displacement control; failure modes; force control; loading strain; pad lift; strain rate effects; strain-controlled bending test; Capacitive sensors; Displacement control; Equations; Fatigue; Force control; Life testing; Predictive models; Soldering; Strain control; Strain measurement; Strain-controlled bending fatigue test; failure mode; lifetime; strain range; strain rate;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4244-2739-0

Electronic_ISBN

978-1-4244-2740-6

Type

conf

DOI

10.1109/ICEPT.2008.4607132

Filename

4607132