DocumentCode :
2688726
Title :
Robust loop parameters for ball neck strength enhancement [package wire bonding]
Author :
Liu, Hongying ; Ong, Dr S H ; Tang, L.C.
Author_Institution :
STMicroelectron. Pte. Ltd., Singapore
fYear :
1998
fDate :
8-10 Dec 1998
Firstpage :
313
Lastpage :
317
Abstract :
A fractional factorial designed experiment was carried out to study the wire neck strength of gold ball bonding for the QFP160L package. Five wire loop parameters, reverse length (RL), reverse height (RH), loop height (LH), ball security height (BSH) and loop factor A (A), were evaluated. The wire neck strength of the gold ball was measured by the wire pull test. In addition, temperature cycling was used as a means to study the reliability of wire neck formation. Analysis of the results shows the following conclusions: (1) RL should be set at a low level to prevent violent bending on the wire neck area; (2) high settings of A and RH can provide stronger wire neck strength; (3) BSH should be set lower than RH; (4) LH did not have much effect on the wire neck strength. The fractional factorial design proved to be extremely useful in optimization of the wire bonding operation and made future fire-fighting for line issues easier
Keywords :
bending; design of experiments; gold; integrated circuit bonding; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; lead bonding; mechanical strength; mechanical testing; optimisation; thermal stresses; Au; QFP160L package; ball neck strength enhancement; ball security height; fractional factorial design; fractional factorial designed experiment; gold ball; gold ball bonding; loop factor A; loop height; loop parameters; package wire bonding; reliability; reverse height; reverse length; temperature cycling; violent wire neck area bending; wire bonding optimization; wire loop parameters; wire neck formation; wire neck strength; wire pull test; Bonding; Design optimization; Gold; Neck; Packaging; Robustness; Security; Temperature; Testing; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference, 1998. Proceedings of 2nd
Print_ISBN :
0-7803-5141-X
Type :
conf
DOI :
10.1109/EPTC.1998.756022
Filename :
756022
Link To Document :
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