Title :
Influence of underfill methods on the solder joint fatigue of wafer level packaging
Author :
Regard, Charles ; Gautier, Christian ; Fremont, Hélène ; Poirier, Patrick
Author_Institution :
Quality & Anal. Service, NXP Semicond., Caen
Abstract :
To increase miniaturization, CSWLP (chip size wafer level packaging) has been developed. However, the difficulty to get good solder joint reliability leads to manufacture only small CSWLP modules. Different underfill methods are evaluated here, by measurements and simulations: results prove that underfill is necessary, but a bad choice can also decrease the reliability. An original method called ldquore-enforcementrdquo improves the life time.
Keywords :
integrated circuit reliability; modules; soldering; wafer level packaging; CSWLP modules; chip size wafer level packaging; re-enforcement; solder joint fatigue; solder joint reliability; underfill methods; Assembly; Electronics packaging; Fatigue; Lead; Manufacturing processes; Silicon; Soldering; Testing; US Department of Energy; Wafer scale integration; CSWLP; Re-enforcement; Reliability; Thermal shock; Underfill;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-2739-0
Electronic_ISBN :
978-1-4244-2740-6
DOI :
10.1109/ICEPT.2008.4607137
