Adhesion between moulding compound and substrate

A theory taken from composite materials is applied to determine the adhesion between molding compound and chip by means of nondestructive dynamic-mechanical experiments. A test rod with an incorporated metal strip (Cu, Si, etc.) can be used to determine adhesion strength as a characteristic quality feature. The advantage compared with destructive test methods is that the same rod can be used for temperature-dependent measurements and can be reused after different storage cycles. The results indicate a worse adhesion between the low-stress molding compounds and copper or silicon in comparison with standard materials.<>