DocumentCode
2689049
Title
MCM interconnect test scheme based on adaptive genetic algorithm
Author
Lei, Chen
Author_Institution
Guilin Univ. of Electron. Technol., Guilin
fYear
2008
fDate
28-31 July 2008
Firstpage
1
Lastpage
3
Abstract
Interconnect test technology has become a bottleneck in the application of multi-chip module (MCM), so study on new methods of test generation to acquire better test set is significant. This paper presents a novel optimization approach of adaptive genetic algorithm (AGA) for the MCM interconnect test generation problem. By combing the characteristics of MCM interconnect test, an accurate fitness function is designed to compute the fitness of each candidate vector. AGA is composed of populations of chromosomes and three evolutionary operators: selection, crossover and mutation. The international standard MCM benchmark circuit was used to verify the approach. Comparing with not only the evolutionary algorithms, but also the deterministic algorithms, experimental results demonstrate that the hybrid approach can achieve high fault coverage, short CPU time and compact test set, which shows that it is a novel optimized method deserving research.
Keywords
circuit optimisation; genetic algorithms; integrated circuit interconnections; integrated circuit testing; multichip modules; CPU time; MCM interconnect test technology; adaptive genetic algorithm; chromosomes; compact test set; deterministic algorithms; evolutionary algorithms; evolutionary operators; international standard MCM benchmark circuit; multichip module; mutation; optimization approach; test generation; Circuit faults; Circuit testing; Electrical fault detection; Electronics packaging; Fault detection; Genetic algorithms; Genetic mutations; Integrated circuit interconnections; Integrated circuit technology; Logic; MCM (Multi-chip Module); adaptive genetic algorithm; interconnect test; test generation;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
Conference_Location
Shanghai
Print_ISBN
978-1-4244-2739-0
Electronic_ISBN
978-1-4244-2740-6
Type
conf
DOI
10.1109/ICEPT.2008.4607156
Filename
4607156
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