Title :
Investigation on fatigue-creep interaction damage model for solder
Author :
Liu, Na ; Li, Xiaoyan ; Yan, Yongchang
Author_Institution :
Sch. of Mater. Sci. & Eng., Beijing Univ. of Technol., Beijing
Abstract :
It is well known, reliability and workability are the more important issues in the field of chip size package (CSP). Creep and fatigue behaviors are the main loads of the solder joints, the reliability of which should take account of those two main loads. Based on the theory of continuum damage mechanics (CDM), this paper focuses on damage evolution of interaction between the fatigue and creep. A new damage model of fatigue-creep interaction has been developed. And the new fatigue-creep interaction damage model in this paper does not require the simple fatigue model and simple creep model.
Keywords :
chip scale packaging; creep; failure analysis; fatigue; reliability; solders; workability; chip size package; continuum damage mechanics; electronic packaging; fatigue-creep interaction damage model; solder joint reliability; solder joint workability; Creep; Fatigue; Lead; Materials reliability; Materials science and technology; Reliability engineering; Soldering; Stress; Temperature; Workability;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-2739-0
Electronic_ISBN :
978-1-4244-2740-6
DOI :
10.1109/ICEPT.2008.4607157
