Investigation on fatigue-creep interaction damage model for solder

Author

Liu, Na ; Li, Xiaoyan ; Yan, Yongchang

Author_Institution

Sch. of Mater. Sci. & Eng., Beijing Univ. of Technol., Beijing

fYear

2008

fDate

28-31 July 2008

Firstpage

1

Lastpage

3

Abstract

It is well known, reliability and workability are the more important issues in the field of chip size package (CSP). Creep and fatigue behaviors are the main loads of the solder joints, the reliability of which should take account of those two main loads. Based on the theory of continuum damage mechanics (CDM), this paper focuses on damage evolution of interaction between the fatigue and creep. A new damage model of fatigue-creep interaction has been developed. And the new fatigue-creep interaction damage model in this paper does not require the simple fatigue model and simple creep model.

Keywords

chip scale packaging; creep; failure analysis; fatigue; reliability; solders; workability; chip size package; continuum damage mechanics; electronic packaging; fatigue-creep interaction damage model; solder joint reliability; solder joint workability; Creep; Fatigue; Lead; Materials reliability; Materials science and technology; Reliability engineering; Soldering; Stress; Temperature; Workability;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4244-2739-0

Electronic_ISBN

978-1-4244-2740-6

Type

conf

DOI

10.1109/ICEPT.2008.4607157

Filename

4607157