DocumentCode :
2689189
Title :
Long-term measurement results of pre-charged CMUTs with zero external bias operation
Author :
Min-Chieh Ho ; Kupnik, Mario ; Kwan Kyu Park ; Khuri-Yakub, Butrus T.
Author_Institution :
Stanford Univ., Stanford, CA, USA
fYear :
2012
fDate :
7-10 Oct. 2012
Firstpage :
89
Lastpage :
92
Abstract :
We present long-term measurement results (>1.5 years) of CMUTs, which have been pre-charged for zero external bias operation. The fabrication is based on a direct wafer bonding process with a thick-buried-oxide-layer, which allows the realization of only partially connected, donut-shaped bottom electrodes. The only partially connected bottom electrode has a central portion that is completely encapsulated by 3-μm-thick thermally-grown silicon dioxide, and, thus, electrically floating. The devices are pre-charged by applying a dc voltage higher than the pull-in voltage, which injects charges into the electrically floating portion and creates a sufficiently strong intrinsic electric field in the gap. Measurements of resonant frequency at various bias voltages show that the charges have completely remained in the floating portion for the last 19 months. We prove the zero-external-bias operations with the pre-charged CMUTs by measuring the electrical input impedance, the ac signal displacement, and pitch-catch measurements under zero external dc bias voltage. Our results show that pre-charging CMUTs is feasible, and that the devices are capable of long-term, zero external bias voltage operation.
Keywords :
capacitive sensors; displacement measurement; electric impedance measurement; electrodes; encapsulation; frequency measurement; micromachining; microsensors; silicon compounds; ultrasonic transducers; wafer bonding; AC signal displacement; SiO2; capacitive micromachined ultrasonic transducer; direct wafer bonding process; donut-shaped bottom electrode; electric field; electrical input impedance measurement; electrically floating portion; encapsulation; long-term measurement; partially connected bottom electrode; pitch-catch measurement; pre-charged CMUT; pull-in dc voltage; resonant frequency measurement; size 3 mum; thermally-grown silicon dioxide; thick-buried-oxide-layer; time 19 month; zero external DC bias voltage; zero external bias operation; Displacement measurement; Electrodes; Frequency measurement; Impedance; RLC circuits; Resonant frequency; Voltage measurement; CMUT; charging; partial electrode; thick BOX fabrication process; zero-external-bias operation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics Symposium (IUS), 2012 IEEE International
Conference_Location :
Dresden
ISSN :
1948-5719
Print_ISBN :
978-1-4673-4561-3
Type :
conf
DOI :
10.1109/ULTSYM.2012.0022
Filename :
6562093
Link To Document :
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