Title :
Tape-automated-bonding
Abstract :
The characteristics of the tape automated bonding (TAB) technique are discussed. New bumping technologies and inner lead bonding methods are described. It is concluded that the TAB technique is applicable for future high-pin-count and high-speed devices: the existing technology offers reliable interconnects.<>
Keywords :
VLSI; packaging; tape automated bonding; TAB; bumping technologies; characteristics; high-pin-count devices; high-speed devices; inner lead bonding methods; reliable interconnects; tape automated bonding; Assembly; Bonding; Conductors; Contacts; Delay; Frequency; Integrated circuit interconnections; Packaging; Very large scale integration; Wire;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1990, IEMT Conference., 8th IEEE/CHMT International
Conference_Location :
Baveno, Italy
DOI :
10.1109/IEMT8.1990.171062
