• DocumentCode
    2690233
  • Title

    Green strain based FE modeling of rheological objects for handling large deformation and rotation

  • Author

    Wang, Zhongkui ; Hirai, Shinichi

  • Author_Institution
    Dept. of Robot., Ritsumeikan Univ., Kusatsu, Japan
  • fYear
    2011
  • fDate
    9-13 May 2011
  • Firstpage
    4762
  • Lastpage
    4767
  • Abstract
    Rheological object, such as clay, various food products, biological organs and tissues, has both elastic and plastic properties. Modeling of such objects has not been studied intensively comparing with elastic objects. Previous rheological models were mostly based on linear constitutive law of stress and strain, which is limited to small deformation. In this paper, finite element (FE) model of rheological objects based on linear Cauchy strain tensor was summarized at first. Nonlinear FE model formulated with Green strain tensor was then presented for simulating large deformation and deformation with rotation motion. Instead of constant and symmetrical connection matrices in the linear model, nonlinear model yields non-constant and unsymmetrical connection matrices, which vary with displacements of nodal points. Simulation results with both linear and nonlinear FE models were presented to show the differences. We found that the nonlinear model formulated with Green strain tensor demonstrates more natural simulation behaviors.
  • Keywords
    elastic deformation; elastoplasticity; finite element analysis; plastic deformation; rheology; stress-strain relations; FE modeling; displacements; elastic objects; elastic properties; finite element model; green strain tensor; large deformation; linear Cauchy strain tensor; plastic properties; rheological objects; stress-strain linear constitutive law; unsymmetrical connection matrices; Computational modeling; Deformable models; Iron; Mathematical model; Strain; Symmetric matrices; Tensile stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Robotics and Automation (ICRA), 2011 IEEE International Conference on
  • Conference_Location
    Shanghai
  • ISSN
    1050-4729
  • Print_ISBN
    978-1-61284-386-5
  • Type

    conf

  • DOI
    10.1109/ICRA.2011.5979732
  • Filename
    5979732