DocumentCode
2690269
Title
Automated Interconnect on GaAs Integrated Circuits
Author
Pavio, J.S. ; Bretzke, D.
fYear
1986
fDate
2-4 June 1986
Firstpage
423
Lastpage
426
Abstract
Although GaAs integrated circuits provide significant advantage over silicon in both digital, microwave applications, automated assembly of this brittle material presents a considerable technical challenge. As volume and cost effective demands increase, automated interconnect becomes a key requirement. This paper discusses how automation can be achieved with consistent reliability in ball bonding on GaAs.
Keywords
Application specific integrated circuits; Assembly; Automation; Costs; Digital integrated circuits; Gallium arsenide; Integrated circuit interconnections; Integrated circuit reliability; Microwave integrated circuits; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 1986 IEEE MTT-S International
Conference_Location
Baltimore, MD, USA
ISSN
0149-645X
Type
conf
DOI
10.1109/MWSYM.1986.1132210
Filename
1132210
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