• DocumentCode
    2690838
  • Title

    Auction Based E-Procurement Mechanism Design

  • Author

    Wu, Gang ; Yang Jian-mei

  • Author_Institution
    Sch. of Bus. Adm., South China Univ. of Technol., Guangzhou, China
  • fYear
    2009
  • fDate
    16-17 May 2009
  • Firstpage
    254
  • Lastpage
    258
  • Abstract
    With the advent of the Internet in business world, buyers need at times to make use of competitive procurement strategies for certain purchases. Since auction based mechanisms enabled a promising way of automating negotiations, they have been relevant in e-procurement systems. In this paper, a new three-stage e-procurement mechanism is designed flexibly combined several categories of auctions such as sealed auction, multiattribute open auction and reverse auction in considering of procurement contexts. In the first stage, a single round sealed bidding is performed to decide on next process selection. In the second stage, the contract is competitively negotiated by a multiattribute open auction. If more than one offerpsilas score enter into preestablished score area, then the third stage will be started. Otherwise, the ceiling score offer is the winner. In the third stage, offerpsilas non-price attributes should have been defined in detail, and the lowest price will be yielded through open competitive price bidding in an online real-time dynamic reverse auction. Applying the new designed mechanism, purchasers can achieve the ideal goals of procurement efficiency and cost minimization.
  • Keywords
    Internet; electronic commerce; procurement; Internet; auction; competitive procurement strategies; e-procurement mechanism design; multiattribute open auction; online real-time dynamic reverse auction; procurement contexts; Business; Communications technology; Contracts; Costs; Design engineering; Enterprise resource planning; Internet; Materials requirements planning; Procurement; Supply chains; Auction; E-Procurement; Mechanism Design;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Information Engineering and Electronic Commerce, 2009. IEEC '09. International Symposium on
  • Conference_Location
    Ternopil
  • Print_ISBN
    978-0-7695-3686-6
  • Type

    conf

  • DOI
    10.1109/IEEC.2009.59
  • Filename
    5175115