DocumentCode :
2691414
Title :
Cavity model applied to power/ground plane structures
Author :
Huang, Chien-Chang
Author_Institution :
Dept. of Commun. Eng., Yuan Ze Univ., Taoyuan, Taiwan
fYear :
2005
fDate :
3-8 July 2005
Firstpage :
397
Abstract :
Power/ground plane structures are usually used in the multilayer printed circuit boards (PCBs) for digital circuits and systems. Due to the very small thickness compared with the PCB dimensions, the planes behave somewhat like resonators, so that a signal at some point of the PCB may couple strongly to another via the cavity for certain resonant frequencies. In practical cases, switching states in the digital circuit cause abrupt changes of currents from the power plane, inducing delta-1 noise in radial wave modes to propagate to any part of the PCB, and produce interference or even system malfunctions. The paper presents a modal analysis and simulation results of the power/ground planes in PCBs based on a simple cavity model with experimental verification. This frequency-domain approach can acquire some impedance values directly that can be very useful in primary board-level designs for high-speed digital circuits and systems. By using model order reduction techniques, the frequency data can also be used to construct the macro-models in SPICE usage for further waveform simulations.
Keywords :
cavity resonators; circuit noise; electric impedance; electromagnetic interference; frequency-domain analysis; modal analysis; printed circuit design; printed circuits; SPICE; cavity model; delta-1 noise; digital circuits; frequency-domain approach; impedance values; macro-models; modal analysis; model order reduction; multilayer PCB; multilayer printed circuit boards; power/ground plane structures; radial wave modes; Circuit noise; Circuit simulation; Coupling circuits; Digital circuits; Interference; Nonhomogeneous media; Power system modeling; Printed circuits; Resonant frequency; Switching circuits;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Antennas and Propagation Society International Symposium, 2005 IEEE
Print_ISBN :
0-7803-8883-6
Type :
conf
DOI :
10.1109/APS.2005.1552526
Filename :
1552526
Link To Document :
بازگشت