Title :
Therapy discrimination via global sensitivity analysis of force-induced bone growth and adaptation
Author :
Maldonado, Solvey ; Savchenko, Anton ; Findeisen, Rolf
Author_Institution :
Inst. for Autom. Eng., Otto-Von-Guericke-Univ. Magdeburg, Magdeburg, Germany
Abstract :
Identifying and discriminating plausible treatment targets for remodeling related bone disorders is a difficult task often involving medical studies and clinical experiments. We propose to apply a global sensitivity analysis approach to a mathematical model describing the process of force-induced bone growth and adaptation. The considered sensitivity analysis approach finds an outer bound on the set of possible steady states for regions of parameters and inputs/stimuli. The outer bounding is achieved by a reformulation as a feasibility problem, which is convexified and solved via a semidefinite program. In this work, besides the application of this method to the bone growth and adaptation model, we improve the outer bounds by using a smarter multidimensional bisection algorithm. The results obtained allow for structure discrimination between different treatment therapies with a preferable counteractive effect in relation to the severity degree of the bone loss condition.
Keywords :
biomechanics; bone; medical computing; medical disorders; patient treatment; physiological models; sensitivity analysis; bone adaptation model; bone growth model; bone loss degree; bone loss severity; bone remodeling related disorders; force induced bone adaptation; force induced bone growth; global sensitivity analysis; mathematical model; multidimensional bisection algorithm; semidefinite program; therapy discrimination; treatment targets; Adaptation model; Approximation methods; Bones; Loading; Mathematical model; Sensitivity analysis; Steady-state; Bone formation; Bone functional adaptation; Bone remodeling; Convex relaxations; Rational/polynomial systems; Semidefinite programming; Sensitivity analysis;
Conference_Titel :
Control Applications (CCA), 2010 IEEE International Conference on
Conference_Location :
Yokohama
Print_ISBN :
978-1-4244-5362-7
Electronic_ISBN :
978-1-4244-5363-4
DOI :
10.1109/CCA.2010.5611067