Title :
A Study Of Polyimide Adhesion To Epoxy Resjn In PFP Using Multivariate Analysis Of XPS Spectra
Author :
Takeuchi, Koichi ; Tsutsui, Kaganori ; Miura, Nobuhito
Keywords :
Adhesives; Chemical analysis; Coatings; Epoxy resins; Nitrogen; Performance analysis; Plasma applications; Polyimides; Semiconductor device packaging; Surface topography;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International
Print_ISBN :
0-7803-1432-8
DOI :
10.1109/IEMT.1993.639283
