DocumentCode
2692365
Title
A New Washingless Hybrid-mounting Technique For Bare Chip ICs And SMDs
Author
Ozaki, Hiroshi
fYear
1993
fDate
9-11 Jun 1993
Firstpage
29
Lastpage
32
Keywords
Bonding; Costs; Hybrid integrated circuits; Integrated circuit packaging; Packaging machines; Reflow soldering; Resins; Semiconductor device packaging; Space heating; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International
Print_ISBN
0-7803-1432-8
Type
conf
DOI
10.1109/IEMT.1993.639288
Filename
639288
Link To Document