DocumentCode :
2692365
Title :
A New Washingless Hybrid-mounting Technique For Bare Chip ICs And SMDs
Author :
Ozaki, Hiroshi
fYear :
1993
fDate :
9-11 Jun 1993
Firstpage :
29
Lastpage :
32
Keywords :
Bonding; Costs; Hybrid integrated circuits; Integrated circuit packaging; Packaging machines; Reflow soldering; Resins; Semiconductor device packaging; Space heating; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International
Print_ISBN :
0-7803-1432-8
Type :
conf
DOI :
10.1109/IEMT.1993.639288
Filename :
639288
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2692365
