DocumentCode

2692384

Title

Towards Low Cost High Density Bumping

Author

Aintila, Ahti ; Järvinen, Eero ; Lalu, Sinikka

fYear

1993

fDate

9-11 Jun 1993

Firstpage

33

Lastpage

36

Keywords

Adhesives; Aluminum; Assembly; Bonding; Costs; Gold; Nickel; Passivation; Printed circuits; Surface-mount technology;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International

Print_ISBN

0-7803-1432-8

Type

conf

DOI

10.1109/IEMT.1993.639289

Filename

639289