DocumentCode :
2693061
Title :
High electron mobility germanium MOSFETs: Effect of n-type channel implants and ozone surface passivation
Author :
Hennessy, J. ; Antoniadis, D.A.
Author_Institution :
Massachusetts Inst. of Technol., Cambridge, MA, USA
fYear :
2009
fDate :
22-24 June 2009
Firstpage :
257
Lastpage :
258
Abstract :
Germanium n-channel devices have historically shown poor performance due to an asy mmetric distribution of interface st ates that degrade electrostatic behavior and carrier mobility. In this study we demonstrate two methods for improving the performance of Ge nFETs, ozone surface passivation and ntype ion-implantation. Surface-channel nMOSFETs receiving a combination of O3 passivation and 1*1012 dose As or Sb implants show mobility comparable to the highest reported to date with improved subthreshold slope. Devices showing buried-channel characteristics show even higher peak mobility (higher than Si at low in version densities) illustrating that interface states are still limiting electron mobility in surface-channel Ge devices.
Keywords :
MOSFET; carrier mobility; germanium; high electron mobility transistors; passivation; Ge; buried-channel characteristics; carrier mobility; electrostatic behavior; high electron mobility germanium MOSFET; limiting electron mobility; n-channel devices; n-type channel implant effect; nFET; ozone surface passivation; Aluminum oxide; Charge carrier processes; Electron mobility; Germanium; Implants; MOSFETs; Passivation; Water;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Device Research Conference, 2009. DRC 2009
Conference_Location :
University Park, PA
Print_ISBN :
978-1-4244-3528-9
Electronic_ISBN :
978-1-4244-3527-2
Type :
conf
DOI :
10.1109/DRC.2009.5354921
Filename :
5354921
Link To Document :
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