Title :
Current situation and development of hybrid microelectronics in Japan
Author :
Nihei, K. ; Kanamori, T.
Author_Institution :
OKI Electr. Ind. Co. Ltd., Tokyo, Japan
Abstract :
An outline of the present status and future prospects of hybrid microelectronics in Japan is presented. Particular attention is paid to substrate material technology (glass and ceramic substrates fired at low temperature, polyimide multilayer substrate technology, and chip-on-wafer technology), connection technology (e.g., tape automated bonding), superconductive mounting technology, and hybrid technology for functional devices (thermal head and LED print head technology).<>
Keywords :
hybrid integrated circuits; integrated circuit technology; substrates; tape automated bonding; technological forecasting; Japan; LED print head technology; ceramic substrates; chip-on-wafer technology; connection technology; functional devices; future prospects; glass substrates; hybrid microelectronics; low temperature firing; polyimide multilayer substrate technology; substrate material technology; superconductive mounting technology; tape automated bonding; thermal head; Bonding; Ceramics; Glass; Light emitting diodes; Materials science and technology; Microelectronics; Nonhomogeneous media; Polyimides; Superconductivity; Temperature;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1990, IEMT Conference., 8th IEEE/CHMT International
Conference_Location :
Baveno, Italy
DOI :
10.1109/IEMT8.1990.171085
