Reduction in ohmic loss of small microstrip antennas using multiple copper layers

In this paper, the simulation results of multi-layered miniaturized microstrip antennas were presented. The gain was increased and the method shows a great promise for directivity enhancement of the small antennas, by reducing the resistive losses in stacked multiple thin copper layers. Using the available microfabrication laboratory, multi-layered compact antennas are now being fabricated, and the test results were presented during the symposium. Silicon, or other dielectric, can be used as laminating material, instead of the air gap, in the practical fabrication process