DocumentCode :
2693881
Title :
Small-signal and 30-GHz power performance of AlGaN/GaN HFETs without back barriers
Author :
Higashiwaki, Masataka ; Pei, Yi ; Chu, Rongming ; Mishra, Umesh K.
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of California, Santa Barbara, CA, USA
fYear :
2009
fDate :
22-24 June 2009
Firstpage :
105
Lastpage :
106
Abstract :
Recently, back barrier structures using AlGaN or InGaN have commonly been employed for GaN heterostructure field-effect transistors (HFETs) with a goal of developing high-power amplifiers in the mm-wave frequency range. However, the back barrier possibly causes some disadvantages such as decreases in electron density (ns) and thermal conductivity in exchange for an improvement on output conductance due to its strong carrier confinement. In this work, we characterized capabilities of AlGaN/GaN HFETs without a back barrier for the mm-wave high-power applications. To enhance charge control, the device relied solely on a high gate aspect ratio design by using an extremely thin AlGaN top barrier instead of the back barrier. The decrease in ns caused by the thin AlGaN barrier can be compensated by SiNx deposition. Similar device structures with a gate length (Lg) of 60 nm have demonstrated record RF small-signal characteristics in previous work; therefore, we studied the applicability of this concept to large-signal applications.
Keywords :
III-V semiconductors; aluminium compounds; gallium compounds; millimetre wave field effect transistors; nitrogen; power HEMT; radiofrequency integrated circuits; silicon compounds; AlGaN-GaN; HFET; RF small-signal characteristics; SiN; charge control; frequency 30 GHz; gate length; heterostructure field-effect transistor; high gate aspect ratio design; large-signal application; mm-wave high-power application; power performance; top barrier; Aluminum gallium nitride; Carrier confinement; Electrons; Frequency; Gallium nitride; HEMTs; High power amplifiers; MODFETs; Silicon compounds; Thermal conductivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Device Research Conference, 2009. DRC 2009
Conference_Location :
University Park, PA
Print_ISBN :
978-1-4244-3528-9
Electronic_ISBN :
978-1-4244-3527-2
Type :
conf
DOI :
10.1109/DRC.2009.5354972
Filename :
5354972
Link To Document :
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