Title :
Semiconductor modeling for multi-layer, high field, photo-switch using sub-bandgap photons
Author :
Kelkar, Kapil ; Nunnally, William C.
Author_Institution :
Dept. of Electr. Eng., Missouri Univ., Columbia, MO, USA
Abstract :
High electric field geometries for high power, photo-conductive switches made possible by employing sub-bandgap photons and inter-bandgap dopants / defects are being investigated for compact pulse power systems. The high field, long absorption depth package reduces the required linear mode, optical closure energy and also reduces the conduction current density through the active material and at the contacts. In addition, the long absorption depth package increases the area available for thermal management and in concert with the reduced current density should increase the lifetime of the switch. This paper describes the semiconductor physics modeling of a multi-layer stack of GaAs wafers in a high electric field configuration. The model results of heavily doped n+ regions on electron injection, leakage current, and voltage hold off is discussed In addition, the modeling of the transverse injection of optical closure energy is discussed.
Keywords :
III-V semiconductors; electric fields; gallium arsenide; photoconducting switches; photons; semiconductor device models; semiconductor doping; wafer bonding; GaAs; GaAs wafers; compact pulse power systems; conduction current density; depth package; electric field geometries; electron injection; inter-bandgap dopants; leakage current; optical closure energy; photo-conductive switches; semiconductor physics modeling; subbandgap photons; voltage hold off; Absorption; Current density; Geometrical optics; Optical switches; Power semiconductor switches; Power system modeling; Semiconductor device modeling; Semiconductor device packaging; Semiconductor process modeling; Thermal management;
Conference_Titel :
Pulsed Power Conference, 2003. Digest of Technical Papers. PPC-2003. 14th IEEE International
Conference_Location :
Dallas, TX, USA
Print_ISBN :
0-7803-7915-2
DOI :
10.1109/PPC.2003.1277935