DocumentCode
2694125
Title
Resonant body transistors in standard CMOS technology
Author
Marathe, Radhika ; Wang, W. ; Mahmood, Zohaib ; Daniel, Luca ; Weinstein, D.
Author_Institution
Massachusetts Inst. of Technol., Cambridge, MA, USA
fYear
2012
fDate
7-10 Oct. 2012
Firstpage
289
Lastpage
294
Abstract
This work presents Si-based electromechanical resonators fabricated at the transistor level of a standard SOI CMOS technology and realized without the need for any postprocessing or packaging. These so-called Resonant Body Transistors (RBTs) are driven capacitively and sensed by piezoresistively modulating the drain current of a Field Effect Transistor (FET). First generation devices operating at 11.1-11.5 GHz with footprints of 3μm×5μm are demonstrated. These unreleased bulk acoustic resonators are completely buried within the CMOS stack and acoustic energy at resonance is confined using Acoustic Bragg Reflectors (ABRs). The complimentary TCE of Si/SiO2 in the resonator and the surrounding ABRs results in a temperature stability TCF of <;3 ppm/K. Comparative behavior of devices is also discussed to analyze the effect of fabrication variations and active sensing.
Keywords
CMOS integrated circuits; MOSFET; acoustic microwave devices; acoustic resonators; bulk acoustic wave devices; elemental semiconductors; field effect MMIC; microfabrication; micromechanical resonators; silicon; silicon compounds; thermal expansion; ABR; FET; RBT; RF MEMS resonators; Si-SiO2; TCE; acoustic Bragg reflectors; acoustic energy; electromechanical resonators; field effect transistor; frequency 11.1 GHz to 11.5 GHz; resonant body transistors; standard CMOS technology; standard SOI CMOS technology; temperature stability; thermal coefficient of expansion; transistor level; unreleased bulk acoustic resonators; Acoustics; CMOS integrated circuits; Field effect transistors; Materials; Micromechanical devices; Resonant frequency; Temperature measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium (IUS), 2012 IEEE International
Conference_Location
Dresden
ISSN
1948-5719
Print_ISBN
978-1-4673-4561-3
Type
conf
DOI
10.1109/ULTSYM.2012.0071
Filename
6562387
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