• DocumentCode
    2694125
  • Title

    Resonant body transistors in standard CMOS technology

  • Author

    Marathe, Radhika ; Wang, W. ; Mahmood, Zohaib ; Daniel, Luca ; Weinstein, D.

  • Author_Institution
    Massachusetts Inst. of Technol., Cambridge, MA, USA
  • fYear
    2012
  • fDate
    7-10 Oct. 2012
  • Firstpage
    289
  • Lastpage
    294
  • Abstract
    This work presents Si-based electromechanical resonators fabricated at the transistor level of a standard SOI CMOS technology and realized without the need for any postprocessing or packaging. These so-called Resonant Body Transistors (RBTs) are driven capacitively and sensed by piezoresistively modulating the drain current of a Field Effect Transistor (FET). First generation devices operating at 11.1-11.5 GHz with footprints of 3μm×5μm are demonstrated. These unreleased bulk acoustic resonators are completely buried within the CMOS stack and acoustic energy at resonance is confined using Acoustic Bragg Reflectors (ABRs). The complimentary TCE of Si/SiO2 in the resonator and the surrounding ABRs results in a temperature stability TCF of <;3 ppm/K. Comparative behavior of devices is also discussed to analyze the effect of fabrication variations and active sensing.
  • Keywords
    CMOS integrated circuits; MOSFET; acoustic microwave devices; acoustic resonators; bulk acoustic wave devices; elemental semiconductors; field effect MMIC; microfabrication; micromechanical resonators; silicon; silicon compounds; thermal expansion; ABR; FET; RBT; RF MEMS resonators; Si-SiO2; TCE; acoustic Bragg reflectors; acoustic energy; electromechanical resonators; field effect transistor; frequency 11.1 GHz to 11.5 GHz; resonant body transistors; standard CMOS technology; standard SOI CMOS technology; temperature stability; thermal coefficient of expansion; transistor level; unreleased bulk acoustic resonators; Acoustics; CMOS integrated circuits; Field effect transistors; Materials; Micromechanical devices; Resonant frequency; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium (IUS), 2012 IEEE International
  • Conference_Location
    Dresden
  • ISSN
    1948-5719
  • Print_ISBN
    978-1-4673-4561-3
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2012.0071
  • Filename
    6562387