Some hybrid technologies comparison in the manufacturing of multi-chip modules for space application

Author

Di Marcantonio, U. ; Cirone, R.

Author_Institution

Selenia Spazio, L´´Aquila, Italy

fYear

1990

fDate

0-0 1990

Firstpage

63

Lastpage

72

Abstract

A multichip-module (MCM) hybrid has been manufactured by several technological approaches for space applications. Results of investigations into some technology alternatives to thick-film multilayer technology are presented. In particular, thin-film multilayer technologies using polyimides or SiO/sub 2/ as dielectric have been evaluated, multilayer thin-film technology and low-temperature cofired ceramic multilayer technology allow higher interconnection density and high-speed applications. It has been demonstrated, by an MCM reference hybrid, that modules manufactured by these technologies have at least the same performance as the thick-film version, and allow savings of room and mass.<>

Keywords

hybrid integrated circuits; integrated circuit manufacture; integrated circuit technology; modules; packaging; thin film circuits; SiO/sub 2/; high-speed applications; hybrid technologies; interconnection density; low-temperature cofired ceramic multilayer technology; multi-chip modules; polyimides; space application; thin-film multilayer technologies; Decoding; Dielectric substrates; Dielectric thin films; Manufacturing; Nonhomogeneous media; Packaging; Polyimides; Space technology; Sputtering; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1990, IEMT Conference., 8th IEEE/CHMT International

Conference_Location

Baveno, Italy

Type

conf

DOI

10.1109/IEMT8.1990.171090

Filename

171090