Title :
Design of a versatile die placement system
Author :
Rochat, D. ; Peguiron, S.
Author_Institution :
Valtronic SA, Les Charbonnieres, Switzerland
Abstract :
The design of the versatile die placement system at Valtronic is described. The application of bare integrated circuits to a substrate (die attach) is one of the main operations of the technology. The modules produced by Valtronic (up to 40 different modules a month) can carry up to 20 different dice per substrate. Valtronic has a dedicated machine for its production which allows it to adapt to each product by using the best-suited form of die presentation while offering the ideal compromise between the automation required for the short and medium substrate runs.<>
Keywords :
hybrid integrated circuits; integrated circuit manufacture; microassembling; modules; Valtronic; automation; bare integrated circuits; bonding; die attach; die placement system; hybrid circuit modules; Bonding; Conducting materials; Electronics industry; Glass; Heat sinks; Industrial electronics; Integrated circuit technology; Microassembly; Substrates; Temperature;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1990, IEMT Conference., 8th IEEE/CHMT International
Conference_Location :
Baveno, Italy
DOI :
10.1109/IEMT8.1990.171095
