• DocumentCode
    2695385
  • Title

    High current, high di/dt semiconductor devices for single- and repetitive pulse applications

  • Author

    Welleman, A. ; Fleischmann, W.

  • Author_Institution
    ABB Switzerland Ltd, Semicond., Lenzburg, Switzerland
  • Volume
    2
  • fYear
    2003
  • fDate
    15-18 June 2003
  • Firstpage
    1213
  • Abstract
    A presentation is given about semiconductor devices specially designed for high di/dt and high current switching. These products include standard and optimized silicon designs with one or several chips in one ceramic housing. In this way, extreme high current and voltage ranges are achieved. With bipolar technology di/dt values of up to 50 KA//spl mu/s, and current capabilities of up to 150 kA is reached with one device. All presented devices are easy stackable and because most of them have an integrated driver unit. Also press-pack IGBT devices are presented with blocking voltages between 2.5 and 5.2 kV per device. These so-called StakPak™ IGBT devices offer a short circuit failure mode and an almost ideal current sharing in the module. All products presented are produced on production lines for standard high power semiconductors and therefore benefit from the same reliability, quality and availability.
  • Keywords
    elemental semiconductors; insulated gate bipolar transistors; power semiconductor switches; pulse circuits; short-circuit currents; silicon; StakPak™ bipolar technology; blocking voltages; ceramic housing; high current switching; high di/dt semiconductor devices; integrated driver unit; optimized silicon designs; press-pack IGBT devices; production lines; repetitive pulse applications; short circuit failure mode; single pulse applications; Availability; Ceramics; Design optimization; Driver circuits; Insulated gate bipolar transistors; Production; Semiconductor device reliability; Semiconductor devices; Silicon; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Pulsed Power Conference, 2003. Digest of Technical Papers. PPC-2003. 14th IEEE International
  • Conference_Location
    Dallas, TX, USA
  • Print_ISBN
    0-7803-7915-2
  • Type

    conf

  • DOI
    10.1109/PPC.2003.1278031
  • Filename
    1278031