Title :
Special capabilities of an optimized contact/proximity aligner for applications using DuPont Riston
Author :
Reyerse, Costant
Abstract :
The author describes the essential elements of a mask aligner configured to meet the demands of the high-density microinterconnect (HDMI) market. Emphasis is placed on the specific requirements of DuPont Riston when used with multichip module substrates. Issues specific to use of Dupont Riston on typical HDMI substrates, as well as the specifications of the exposure tool, are addressed. A formula is presented which is used as a basis for optimizing the mask aligner to provide a complete aligner that will address the issues unique to HDMI. Factors considered are method of exposure, available intensity, method of handling, and optics.<>
Keywords :
integrated circuit manufacture; modules; packaging; position control; DuPont Riston; HDMI substrates; exposure tool; high density microinterconnect; intensity; mask aligner; method of exposure; method of handling; multichip module substrates; optics; optimized contact/proximity aligner; Ceramics; Conducting materials; Copper; Integrated circuit interconnections; Nonhomogeneous media; Packaging; Silicon; Substrates; Thermal conductivity; Thermal expansion;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1990, IEMT Conference., 8th IEEE/CHMT International
Conference_Location :
Baveno, Italy
DOI :
10.1109/IEMT8.1990.171099
