Title :
InterSociety Conference on Thermal Phenomena in Electronic Systems. I-THERM II (Cat. No.90CH2798-7)
Abstract :
The following topics are dealt with: thermally induced failures in electronic systems; phase change and cryogenic thermal control; thermal modeling of computer systems and peripheral equipment; heat transfer in electronic devices and packages; and direct air cooling of electronic components. Abstracts of individual papers can be found under the relevant classification codes in this or other issues
Keywords :
cooling; failure analysis; packaging; cryogenic thermal control; direct air cooling; heat transfer in electronic devices; heat transfer in packages; phase change thermal control; thermal modeling of computer systems; thermal modeling of peripheral equipment; thermally induced failures in electronic systems;
Conference_Titel :
Thermal Phenomena in Electronic Systems, 1990. I-THERM II., InterSociety Conference on
Conference_Location :
Las Vegas, NV, USA
DOI :
10.1109/ITHERM.1990.113318
