DocumentCode
2696178
Title
Comparisons of various cooling schemes within a confined space
Author
Yeh, L.T.
Author_Institution
Texas Instruments Inc., Plano, TX, USA
fYear
1990
fDate
23-25 May 1990
Firstpage
113
Lastpage
119
Abstract
Consideration is given to a array consisting of a number of identical electronic modules. The modules are arranged into many rows, and each row includes a number of modules (18 modules in the present case). Each module dissipates 14 W. To reduce the maximum temperature and temperature variation over the array, several cooling schemes are investigated: (1) a single, unidirectional flow; (2) a side-by-side, bidirectional flow, and (3) a top-to-bottom, bidirectional flow. Numerical examples are used to demonstrate the features of each approach. It is found that the top-to-bottom, bidirectional flow system is the most effective cooling method in maintaining low temperature and the small temperature differences of the system. For a given flow rate, the effect of the unequal channel flow on the temperature distribution is also discussed
Keywords
cooling; design engineering; modules; packaging; confined space; cooling schemes; maintaining low temperature; number of identical electronic modules; side-by-side bidirectional flow; temperature distribution; temperature variation; top-to-bottom bidirectional flow; unidirectional flow; Contact resistance; Electronic equipment; Electronics cooling; Heat transfer; Instruments; Space cooling; Surface resistance; System performance; Temperature control; Temperature distribution;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal Phenomena in Electronic Systems, 1990. I-THERM II., InterSociety Conference on
Conference_Location
Las Vegas, NV
Type
conf
DOI
10.1109/ITHERM.1990.113320
Filename
113320
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