• DocumentCode
    2696178
  • Title

    Comparisons of various cooling schemes within a confined space

  • Author

    Yeh, L.T.

  • Author_Institution
    Texas Instruments Inc., Plano, TX, USA
  • fYear
    1990
  • fDate
    23-25 May 1990
  • Firstpage
    113
  • Lastpage
    119
  • Abstract
    Consideration is given to a array consisting of a number of identical electronic modules. The modules are arranged into many rows, and each row includes a number of modules (18 modules in the present case). Each module dissipates 14 W. To reduce the maximum temperature and temperature variation over the array, several cooling schemes are investigated: (1) a single, unidirectional flow; (2) a side-by-side, bidirectional flow, and (3) a top-to-bottom, bidirectional flow. Numerical examples are used to demonstrate the features of each approach. It is found that the top-to-bottom, bidirectional flow system is the most effective cooling method in maintaining low temperature and the small temperature differences of the system. For a given flow rate, the effect of the unequal channel flow on the temperature distribution is also discussed
  • Keywords
    cooling; design engineering; modules; packaging; confined space; cooling schemes; maintaining low temperature; number of identical electronic modules; side-by-side bidirectional flow; temperature distribution; temperature variation; top-to-bottom bidirectional flow; unidirectional flow; Contact resistance; Electronic equipment; Electronics cooling; Heat transfer; Instruments; Space cooling; Surface resistance; System performance; Temperature control; Temperature distribution;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal Phenomena in Electronic Systems, 1990. I-THERM II., InterSociety Conference on
  • Conference_Location
    Las Vegas, NV
  • Type

    conf

  • DOI
    10.1109/ITHERM.1990.113320
  • Filename
    113320