Title :
Point source thermal response of five-layer anisotropic plate structures
Author :
Min, Y. Jay ; Palisoc, Arthur L. ; Lee, Chin C.
Author_Institution :
Dept. of Electr. & Comput. Eng., California Univ., Irvine, CA, USA
Abstract :
The transfer function of a five-layer anisotropic composite structure is derived. Using the inverse Fourier transform, the point source thermal response of the structure is obtained. The availability of this point source response simplifies the computation of the parameters of the unit thermal profile for real-time thermal design. For structures having embedded heat sources of arbitrary geometries, the temperature solution can be derived using the inverse Fourier transform method or the convolution method, thus greatly extending the type of electron devices which can be studied using analytical methods
Keywords :
cooling; electronic engineering computing; packaging; thermal resistance; analytical methods; anisotropic composite structure; convolution method; electron device types extension; embedded heat sources; five-layer anisotropic plate structures; inverse Fourier transform; point source thermal response; real-time thermal design; temperature solution; transfer function; unit thermal profile; Anisotropic magnetoresistance; Convolution; Electronic packaging thermal management; Fourier transforms; Geometrical optics; Heat transfer; Integrated circuit packaging; Shape; Temperature; Thermal conductivity;
Conference_Titel :
Thermal Phenomena in Electronic Systems, 1990. I-THERM II., InterSociety Conference on
Conference_Location :
Las Vegas, NV
DOI :
10.1109/ITHERM.1990.113325
