DocumentCode :
2696328
Title :
Experimental modeling of convection upstream from a row of electronic packages
Author :
Wirtz, R.A. ; McAuliffe, Wayne
Author_Institution :
Dept. of Mech. Eng., Nevada Univ., Reno, NV, USA
fYear :
1990
fDate :
23-25 May 1990
Firstpage :
165
Lastpage :
170
Abstract :
Experiments on convective heat transfer immediately upstream of a row of closely spaced electronic packages are reported. Flow visualization and interferometric heat transfer measurements were made in an induced draft wind tunnel where the package row is modeled with a two-dimensional transverse rib attached to one channel wall. The transverse rib has an aspect ratio of 4.3, and the channel-height-to-rib-height ratio was varied between 1.2 and 4.0. Results are reported for Reynolds numbers ranging from 2000 to 5000. Flow visualization shows that the approach flow separates from the channel wall approximately one rib height upstream from the rib. Under most conditions the region of separated flow consists of a single cell; under some circumstances a quasi-steady double-cell structure is observed. The region of reduced heat transfer extends approximately 2.5 rib heights upstream, with the heat transfer coefficient dropping to very small values near the recirculating cell. The average heat transfer upstream from the rib is reduced to approximately 50% of that which would occur in the absence of the rib. It is found that if as little as 10% of the approach flow is removed from the base region at the front of the rib, the heat transfer coefficient is restored to values which would occur in the absence of the rib
Keywords :
convection; cooling; flow visualisation; packaging; thermal resistance; Reynolds numbers; aspect ratio; convection upstream; convective heat transfer; eddies; experimental modeling; flow visualization; forced air cooling; heat transfer upstream; induced draft wind tunnel; interferometric heat transfer measurements; quasi-steady double-cell structure; region of reduced heat transfer; region of separated flow; row of electronic packages; Coolants; Electronic packaging thermal management; Electronics packaging; Heat transfer; Hydraulic diameter; Mechanical engineering; Printed circuits; Temperature; Thermal conductivity; Visualization;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal Phenomena in Electronic Systems, 1990. I-THERM II., InterSociety Conference on
Conference_Location :
Las Vegas, NV
Type :
conf
DOI :
10.1109/ITHERM.1990.113328
Filename :
113328
Link To Document :
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