• DocumentCode
    2696409
  • Title

    Applying laminated busbars to enhance DC power distribution systems

  • Author

    Stibgen, Michael

  • Author_Institution
    Methode Electron. Inc., Rolling Meadows, IL, USA
  • fYear
    2004
  • fDate
    19-23 Sept. 2004
  • Firstpage
    537
  • Lastpage
    541
  • Abstract
    The intent of this paper will be an overview of how to design and implement laminated busbars into DC power distribution systems. It will include; electrical, physical and thermal characteristics obtained by utilizing a laminated busbar for DC power distribution. The power density of today´s technology requires the power distribution system to play an active role in compacting size while not sacrificing electrical, physical or thermal constraints of the devices it supplies. In systems where high levels of electrical power are being used, designers must analyze and optimize the method by which power is being distributed. Power distribution issues can have a dramatic affect on the cost, performance, reliability and size of systems. Designing a complete power distribution package that incorporates both power and signal level distribution, along with circuit protection into one sub-system can greatly reduce overall system size.
  • Keywords
    busbars; costing; laminations; optimisation; power distribution protection; power distribution reliability; substation protection; DC power distribution system; circuit protection; costing; electric characteristics; laminated busbars; optimization; physical constraints; power density; power sub-system; reliability; signal level distribution; system size reduction; thermal characteristics; Capacitance; Circuits; Conducting materials; Conductors; Costs; Dielectrics and electrical insulation; Power distribution; Power system reliability; Seals; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Telecommunications Energy Conference, 2004. INTELEC 2004. 26th Annual International
  • Print_ISBN
    0-7803-8458-X
  • Type

    conf

  • DOI
    10.1109/INTLEC.2004.1401521
  • Filename
    1401521