• DocumentCode
    2697262
  • Title

    A new 3D FEM formulation for the solution of potential fields in magnetic induction problems

  • Author

    Tek, M. Nejat ; Gençer, Nevzat G.

  • Author_Institution
    Dept. of Electr. & Electron. Eng., Middle East Tech. Univ., Ankara, Turkey
  • Volume
    6
  • fYear
    1997
  • fDate
    30 Oct-2 Nov 1997
  • Firstpage
    2470
  • Abstract
    Time-varying magnetic fields are applied to living tissues for different purposes in medicine. For all applications, the induced current distributions must be accurately estimated in order to obtain the desired medical results. In this study a new 3D finite element method (FEM) formulation is derived. A code is prepared to implement these formulations using 20 noded isoparametric cubic elements. The accuracy of solutions is tested for three simple geometries and series expansion method is used to derive analytical expressions whenever it is necessary. It is shown that, for the selected geometries error in FEM solutions are less than 1%, and can be improved by increasing the number of nodes. The new 3D FEM solver runs in a 186 MHz PC using 128 Mbyte memory and is capable of solving a problem with 100,000 nodes in 80 minutes
  • Keywords
    bioelectric phenomena; biological effects of fields; biological tissues; electromagnetic induction; finite element analysis; magnetic field effects; 128 Mbyte; 186 MHz; 3D FEM formulation; 80 min; analytical expressions; desired medical results; induced current distributions; living tissues; magnetic induction problems; noded isoparametric cubic elements; potential fields solution; series expansion method; time-varying magnetic fields; Biomedical imaging; Coils; Conductivity; Current distribution; Finite element methods; Geometry; Magnetic fields; Medical diagnostic imaging; Numerical analysis; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 1997. Proceedings of the 19th Annual International Conference of the IEEE
  • Conference_Location
    Chicago, IL
  • ISSN
    1094-687X
  • Print_ISBN
    0-7803-4262-3
  • Type

    conf

  • DOI
    10.1109/IEMBS.1997.756826
  • Filename
    756826