Conductive pattern forming method on vertical wall using spray coating and angled exposure technologies

A novel conductive pattern forming method on the vertical wall using a resist spray coating and an angled exposure technologies is proposed. This method makes it possible to decrease the chip package size. The spray coating and the angled exposure technologies enable the uniform resist coating and the patterning the resist on the vertical wall of 600 mum height. Then a conductive pattern layers are sputtered and electroless plated. As the result, the conductive patterns of 200 mum width and 300 mum spacing is successfully formed on the vertical walls.