• DocumentCode
    2697420
  • Title

    Resistance trace modeling and electromigration immortality criterion based on void growth saturation

  • Author

    Lamontagne, P. ; Ney, D. ; Doyen, L. ; Petitprez, E. ; Wouters, Y.

  • Author_Institution
    STMicroelectronics, Crolles, France
  • fYear
    2010
  • fDate
    2-6 May 2010
  • Firstpage
    922
  • Lastpage
    925
  • Abstract
    In this paper, we present our investigations on time evolution of the resistance during EM tests for various j and L conditions at three different temperatures. These resistance traces have been modeled calculating the void volume kinetic. A good agreement with experimental data was found; in particular the resistance saturation regime at low jL was simulated. From this modeling, we propose an immortality criterion depicted by the product jL2, based on the limitation of the void growth prior to an electrical detection. In the temperature range investigated, no significant variation was found for this criterion.
  • Keywords
    electric resistance; electromigration; EM tests; electrical detection; electromigration immortality criterion; immortality criterion; resistance saturation regime; resistance trace modeling; void growth saturation; void volume kinetic; Copper; Current density; Degradation; Electric resistance; Electromigration; Kinetic theory; Packaging; Stationary state; Temperature distribution; Testing; electromigration; immortality criterion; resistance modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium (IRPS), 2010 IEEE International
  • Conference_Location
    Anaheim, CA
  • ISSN
    1541-7026
  • Print_ISBN
    978-1-4244-5430-3
  • Type

    conf

  • DOI
    10.1109/IRPS.2010.5488704
  • Filename
    5488704