DocumentCode
2697420
Title
Resistance trace modeling and electromigration immortality criterion based on void growth saturation
Author
Lamontagne, P. ; Ney, D. ; Doyen, L. ; Petitprez, E. ; Wouters, Y.
Author_Institution
STMicroelectronics, Crolles, France
fYear
2010
fDate
2-6 May 2010
Firstpage
922
Lastpage
925
Abstract
In this paper, we present our investigations on time evolution of the resistance during EM tests for various j and L conditions at three different temperatures. These resistance traces have been modeled calculating the void volume kinetic. A good agreement with experimental data was found; in particular the resistance saturation regime at low jL was simulated. From this modeling, we propose an immortality criterion depicted by the product jL2, based on the limitation of the void growth prior to an electrical detection. In the temperature range investigated, no significant variation was found for this criterion.
Keywords
electric resistance; electromigration; EM tests; electrical detection; electromigration immortality criterion; immortality criterion; resistance saturation regime; resistance trace modeling; void growth saturation; void volume kinetic; Copper; Current density; Degradation; Electric resistance; Electromigration; Kinetic theory; Packaging; Stationary state; Temperature distribution; Testing; electromigration; immortality criterion; resistance modeling;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium (IRPS), 2010 IEEE International
Conference_Location
Anaheim, CA
ISSN
1541-7026
Print_ISBN
978-1-4244-5430-3
Type
conf
DOI
10.1109/IRPS.2010.5488704
Filename
5488704
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