• DocumentCode
    2697587
  • Title

    IEC 601-1-2 and its impact on medical device manufacturers

  • Author

    Modi, Dan

  • Author_Institution
    Alcon Surg., Irvine, CA, USA
  • Volume
    6
  • fYear
    1997
  • fDate
    30 Oct-2 Nov 1997
  • Firstpage
    2531
  • Abstract
    The world of medicine is growing more dependent on electronics. Also, the congestion of devices in a hospital or clinic, and proliferation of new communication technologies, is forcing the medical devices to operate in a new hostile electromagnetic environment. IEC 601-1-2 titled “Medical Electrical Equipment. Part 1: General requirements for safety; 2. Collateral standard: Electromagnetic Compatibility-Requirements and tests” developed by International Electrotechnical Commission (IEC) sub-committee 62A helped establish a specific Electromagnetic Compatibility (EMC) standard for medical electrical equipment. It is widely used as a basis for EMC approval by several regulatory agencies. This paper discusses the emissions and immunity requirements in the standard. It describes the test limits to be met by the manufacturer and the rationale of the tests. This paper reviews the current requirements as well as provides an insight into the anticipated changes in the second edition of the standard
  • Keywords
    biomedical engineering; biomedical equipment; electromagnetic compatibility; electromagnetic interference; safety; standards; EMC approval; EMC requirements; EMC tests; EMI requirements; IEC 601-1-2 standard; collateral standard; emissions requirements; general requirements for safety; harmonic distortion; immunity requirements; medical electrical equipment; voltage fluctuation limits; Communications technology; Electromagnetic compatibility; Electromagnetic devices; Electronic equipment manufacture; Hospitals; IEC standards; Manufacturing; Safety; Standards development; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 1997. Proceedings of the 19th Annual International Conference of the IEEE
  • Conference_Location
    Chicago, IL
  • ISSN
    1094-687X
  • Print_ISBN
    0-7803-4262-3
  • Type

    conf

  • DOI
    10.1109/IEMBS.1997.756845
  • Filename
    756845