• DocumentCode
    2697841
  • Title

    A built-in aging detection and compensation technique for improving reliability of nanoscale CMOS designs

  • Author

    Dadgour, Hamed F. ; Banerjee, Kaustav

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of California, Santa Barbara, CA, USA
  • fYear
    2010
  • fDate
    2-6 May 2010
  • Firstpage
    822
  • Lastpage
    825
  • Abstract
    The time-dependent degradation (aging) of device characteristics caused by Bias Temperature Instability (BTI) and Hot-Carrier Injection (HCI) are one of the major threats to the reliability of nanoscale digital CMOS designs. To address this challenge, a novel built-in aging “detection” and “compensation” technique is proposed. Performance degradation is detected using a novel area- and power-efficient sensor. Then, to improve the reliability, an adaptive Time-Borrowing (TB)-based compensation technique is employed, which decreases the timing failure probabilities in spite of aged transistors. It is shown via simulations that by employing these techniques, the reliability of circuits can be improved by approximately 10X.
  • Keywords
    CMOS digital integrated circuits; ageing; compensation; hot carriers; integrated circuit design; integrated circuit reliability; nanoelectronics; BTI; HCI; adaptive TB-based compensation technique; adaptive time-borrowing-based compensation technique; aged transistors; area-efficient sensor; bias temperature instability; built-in aging compensation technique; built-in aging detection technique; hot-carrier injection; nanoscale digital CMOS design reliability; power-efficient sensor; time-dependent degradation; timing failure probability; Aging; Circuits; Degradation; Detectors; Flip-flops; Human computer interaction; Nanoscale devices; Sensor phenomena and characterization; Timing; Voltage; Aging; Bias-Temperature Instability; Diagnostics; Fault-Tolerance; Hot-carrier Effect; NBTI; PBTI; Process Variation; Reliability; Robustness; Timing Analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium (IRPS), 2010 IEEE International
  • Conference_Location
    Anaheim, CA
  • ISSN
    1541-7026
  • Print_ISBN
    978-1-4244-5430-3
  • Type

    conf

  • DOI
    10.1109/IRPS.2010.5488727
  • Filename
    5488727