DocumentCode :
2698243
Title :
Scaling reliability and modeling of ferroelectric capacitors
Author :
Acosta, Antonio G. ; Rodriguez, John ; Obradovic, Borna ; Summerfelt, Scott ; San, Tamer ; Green, Keith ; Moise, Ted ; Krishnan, Srikanth
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Florida, Gainesville, FL, USA
fYear :
2010
fDate :
2-6 May 2010
Firstpage :
689
Lastpage :
693
Abstract :
We report on reliability properties of MOCVD PZT ferroelectric capacitors as a function of film thickness. Data is presented for fatigue, thermal depolarization, and imprint. It is important to be able to model these parameters as they can significantly affect the switching polarization, which in turn affects the signal margin of an FRAM circuit. A ferroelectric SPICE model is presented that can be used to accurately simulate hysteresis and switching polarization behavior. This model agrees with experimental data and can be used to simulate FRAM circuit behavior through "end of life".
Keywords :
MOCVD; SPICE; ferroelectric capacitors; ferroelectric storage; integrated circuit modelling; integrated circuit reliability; lead compounds; random-access storage; FRAM circuit; MOCVD ferroelectric capacitor reliability; PZT; ferroelectric SPICE model; ferroelectric random access memory; film thickness; switching polarization; thermal depolarization; Capacitors; Circuit simulation; Fatigue; Ferroelectric films; Ferroelectric materials; MOCVD; Nonvolatile memory; Polarization; Random access memory; Switching circuits; FRAM; SPICE model; ferroelectric capacitor; reliability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium (IRPS), 2010 IEEE International
Conference_Location :
Anaheim, CA
ISSN :
1541-7026
Print_ISBN :
978-1-4244-5430-3
Type :
conf
DOI :
10.1109/IRPS.2010.5488748
Filename :
5488748
Link To Document :
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